Name:Solder Paste 63/37 Sn63Pb37
Name:Tin Lead Solder Paste
Alloy:Tin Lead
Flux:No clean flux
Applications:Reflow soldering of electronics assembly
Country of Origin:China

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  • Solder Paste 63/37 Sn63Pb37

Product Description

Tin Lead Solder Paste 63/37 Sn63Pb37

Tin Lead Solder Paste 63/37, also written as solder paste Sn63Pb37. It’s a paste that is mixed with a no clean flux with tin lead alloy powder 63/37. 

Basic information of Tin Lead Solder Paste 63/37 Sn63Pb37:

Composition: Sn63Pb37, with 63% of tin & 37% of lead.

Powder size: Type 3, 25 to 45 microns. Other powder sizes are available upon requirement.

Flux: No clean type (about 11.5%)

Melting Point: 183

Packing: Jar or Syringe.

Weight: 200g/jar, 500g/jar, 1000g/jar, 2000g/jar or other weight as per customers’ requirements.

Color & Appearance of Paste: Metallic grey paste form.

tin lead solder paste 63/37 Sn63Pb37

Applications of Tin Lead Solder Paste 63/37 Sn63Pb37: 

Solder paste 63/37 is mainly used for SMT (surface mount technology) of PCB assembly, BGA etc. It’s extremely suitable for assembly of small IC or soldering projects that manual soldering by solder wire or wave soldering by solder bar can’t achieve. Tin lead solder paste Sn63Pb37 can be soldered either through hot air gun manual soldering or reflow oven.

tin lead solder paste 63/37 Sn63Pb37 reflow soldering 

Feature of Tin Lead Solder Paste 63/37 Sn63Pb37: 

1. Good wetting property. Solder paste 63/37 is easy to melt & wet fast.

2. No clean. The residue of tin lead solder paste Sn63Pb37 after soldering is non corrosive and transparent, in most general applications there is no need to do cleaning.

3. Stable viscosity during the continuous printing process. 

4. Bright & firm solder joints after soldering. 

Using & Storage of Tin Lead Solder Paste 63/37 Sn63Pb37:

1. Recommended storage of tin lead solder paste 63/37: kept in refrigerator at temperature between 0 to 10.

2. Solder paste Sn63Pb37 must be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the paste enough time to come to thermal equilibrium with the environment.

3. We recommend using out the solder paste 63/37 after the jar is open each time. Mix the paste for at least one minute after fresh jar is open. In case there’s still leftover paste after soldering, it must be tightly sealed and refrigerated when not in use. Before re-using, it’s a must to double check if the solder pastes hasn’t become separated or thicken to its usual state.

4. Read and follow TDS of solder paste Sn63Pb37 before using.

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