Name:Lead Free Solder Bar
Product Type:Tin Lead Free Solder Bar
Place of Origin:Foshan, China
Composition:99.9 of Tin
Percentage of other metal:Ag, Cu as per client's request
Diemension:3.15cmx1.5cmx1.0cm
Weigth:around 500g/PC, total 25kg/box (48PCS/box)
Application:Lead-free automatic wave soldering, applicable to mix substrate or the general wave soldering

  • Lead Free Solder Bar

Product Description

Tin Lead Free Solder Bar:

Our company provides Lead Free Solder Bar with a variety of alloy composition for customer choice. 

Solder Bar

Composition and mechanical data of Lead Free Solder Bar:

Alloy composition (wt.%)

Diemension

(Cm)

Flux Content

Weight / PC

(g)

Melting point ()

Working Tempreture

Usage & Application

Type

Tin-Sn

Silver-Ag

Copper-Cu

SAC305

96.50%

3.00%

0.50%

3.15*1.5*1.0

1.8-2.4%

500

217-219

 280-320

Widely used in lead-free automatic wave soldering, applicable to mix substrate or the general wave soldering

SAC300

97.00%

3.00%

0%

217-220

280-320

SAC0307

99.00%

0.30%

0.70%

217-225

 260-320

SAC07

99.30%

0.00%

0.70%

227

 260-280

Type of Tin Lead Free Solder Bar:

1. Anti-oxidation tin lead free bar

2. High temperature tin lead free bar

3. Low temperature tin lead free bar

4. Dim tin lead free bar

5. Silver tin lead free bar

6. Tin lead free solder bar for other particular applications 

Size of Tin Lead Free Solder Bar:

3.15cm * 1.5cm * 1.0cm

Weight of Tin Lead Free Solder Bar:

500g/PC (Total: 48PCS/box, 25Kg/box) 

Features of Tin Lead Free Solder Bar:

1. Eutectic alloy.

2. Bridge-free and icicle-free soldering.

3. Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.

4. Good through-hole penetration.

5. Good topside fillet formation.

6. Dross rate equal or lower than tin-lead solder.

7. Does not require a nitrogen atmosphere.

8. Does not erode copper from holes, pads and tracks.

9. Low rate of copper leaching makes it easy to control the copper content of the solder bath.

10. Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.

11. Thermal fatigue resistance and creep strength better than tin-lead.

12. Slow, even growth of the intermetallic layer at the solder/substrate interface.

13. Also performs well in selective and dip soldering.

Packing:

Solder bar is packaged with carton

Neutral packing or OEM packing is available

lead free solder bar packing

Lead time: 

We have a lot of stock of Tin Lead Free Solder Bar, if order quantity is not very big, we can send the goods right after receive payment. If order quantity is big, then delivery time is 10days after deposit received.  

Shipping term: 

Small order of tin lead solder bar, will be sent by courier (DHL, FEDEX, TNT and so on). For bigger order quantity, we suggest to ship them by air or by sea. We are near Foshan, Rongqi Port / Guangzhou Port.

Spectrum Analyzer:

Technical support to help customers to analyse their samples, and send out report. 



Production of Lead Free Solder Bar

Production of Solder Bar

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